| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
|
| 309 |  | FORMING BIPOLAR TRANSISTOR BY FORMATION OR ALTERATION OF SEMICONDUCTIVE ACTIVE REGIONS {25} |
| 310 | DF | .~> Gettering of semiconductor substrate |
| 311 | DF | .~> On insulating substrate or layer (i.e., SOI type) |
| 312 | DF | .~> Having heterojunction {7} |
| 322 | DF | .~> Complementary bipolar transistors {3} |
| 328 | DF | .~> Including diode |
| 329 | DF | .~> Including passive device (e.g., resistor, capacitor, etc.) {1} |
| 333 | DF | .~> Having fuse or integral short |
| 334 | DF | .~> Forming inverted transistor structure |
| 335 | DF | .~> Forming lateral transistor structure {4} |
| 340 | DF | .~> Making plural bipolar transistors of differing electrical characteristics |
| 341 | DF | .~> Using epitaxial lateral overgrowth |
| 342 | DF | .~> Having multiple emitter or collector structure |
| 343 | DF | .~> Mesa or stacked emitter |
| 344 | DF | .~> Washed emitter |
| 345 | DF | .~> Walled emitter |
| 346 | DF | .~> Emitter dip prevention or utilization |
| 347 | DF | .~> Permeable or metal base |
| 348 | DF | .~> Sidewall base contact |
| 349 | DF | .~> Pedestal base |
| 350 | DF | .~> Forming base region of specified dopant concentration profile (e.g., inactive base region more heavily doped than active base region, etc.) |
| 351 | DF | .~> Direct application of electrical current |
| 352 | DF | .~> Fusion or solidification of semiconductor region |
| 353 | DF | .~> Including isolation structure {5} |
| 364 | DF | .~> Self-aligned {2} |
| 378 | DF | .~> Radiation or energy treatment modifying properties of semiconductor regions of substrate (e.g., thermal, corpuscular, electromagnetic, etc.) |