438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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309 | | FORMING BIPOLAR TRANSISTOR BY FORMATION OR ALTERATION OF SEMICONDUCTIVE ACTIVE REGIONS {25} |
310 | DF | .~> Gettering of semiconductor substrate |
311 | DF | .~> On insulating substrate or layer (i.e., SOI type) |
312 | DF | .~> Having heterojunction {7} |
322 | DF | .~> Complementary bipolar transistors {3} |
328 | DF | .~> Including diode |
329 | DF | .~> Including passive device (e.g., resistor, capacitor, etc.) {1} |
333 | DF | .~> Having fuse or integral short |
334 | DF | .~> Forming inverted transistor structure |
335 | DF | .~> Forming lateral transistor structure {4} |
340 | DF | .~> Making plural bipolar transistors of differing electrical characteristics |
341 | DF | .~> Using epitaxial lateral overgrowth |
342 | DF | .~> Having multiple emitter or collector structure |
343 | DF | .~> Mesa or stacked emitter |
344 | DF | .~> Washed emitter |
345 | DF | .~> Walled emitter |
346 | DF | .~> Emitter dip prevention or utilization |
347 | DF | .~> Permeable or metal base |
348 | DF | .~> Sidewall base contact |
349 | DF | .~> Pedestal base |
350 | DF | .~> Forming base region of specified dopant concentration profile (e.g., inactive base region more heavily doped than active base region, etc.) |
351 | DF | .~> Direct application of electrical current |
352 | DF | .~> Fusion or solidification of semiconductor region |
353 | DF | .~> Including isolation structure {5} |
364 | DF | .~> Self-aligned {2} |
378 | DF | .~> Radiation or energy treatment modifying properties of semiconductor regions of substrate (e.g., thermal, corpuscular, electromagnetic, etc.) |