438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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510 | DF | INTRODUCTION OF CONDUCTIVITY MODIFYING DOPANT INTO SEMICONDUCTIVE MATERIAL {7} |
542 | | .~ Diffusing a dopant {15} |
543 | DF | .~.~> To control carrier lifetime (i.e., deep level dopant) |
544 | DF | .~.~> To solid-state solubility concentration |
545 | DF | .~.~> Forming partially overlapping regions |
546 | DF | .~.~> Plural dopants in same region (e.g., through same mask opening, etc.) {1} |
548 | DF | .~.~> Plural dopants simultaneously in plural regions |
549 | DF | .~.~> Single dopant forming plural diverse regions (e.g., forming regions of different concentrations or of different depths, etc.) |
550 | DF | .~.~> Nonuniform heating |
551 | DF | .~.~> Using multiple layered mask {1} |
553 | DF | .~.~> Using metal mask |
554 | DF | .~.~> Outwardly |
555 | DF | .~.~> Laterally under mask opening |
556 | DF | .~.~> Edge diffusion by using edge portion of structure other than masking layer to mask |
557 | DF | .~.~> From melt |
558 | DF | .~.~> From solid dopant source in contact with semiconductor region {6} |
565 | DF | .~.~> From vapor phase {3} |