US Patent Class 216
ETCHING A SUBSTRATE: PROCESSES-- Main Headings




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Current as of: June, 1999
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CLASS NOTES
2  DF  ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION
3  DF  FORMING OR TREATING JOSEPHSON JUNCTION ARTICLE
4  DF  FORMING OR TREATING A SIGN OR MATERIAL USEFUL IN A SIGN {1}
6  DF  FORMING OR TREATING MATERIAL USEFUL IN A CAPACITOR
7  DF  FORMING OR TREATING FIBROUS ARTICLE OR FIBER REINFORCED COMPOSITE STRUCTURE
8  DF  FORMING OR TREATING CYLINDRICAL OR TUBULAR ARTICLE HAVING PATTERN OR DESIGN ON ITS SURFACE {2}
11  DF  FORMING OR TREATING AN ARTICLE WHOSE FINAL CONFIGURATION HAS A PROJECTION
12  DF  FORMING OR TREATING MASK USED FOR ITS NONETCHING FUNCTION (E.G., SHADOW MASK, X-RAY MASK, ETC.)
13  DF  FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.) {6}
22  DF  FORMING OR TREATING ARTICLE CONTAINING MAGNETICALLY RESPONSIVE MATERIAL
23  DF  FORMING OR TREATING ARTICLE CONTAINING A LIQUID CRYSTAL MATERIAL
24  DF  FORMING OR TREATING OPTICAL ARTICLE {2}
27  DF  FORMING OR TREATING THERMAL INK JET ARTICLE (E.G., PRINT HEAD, LIQUID JET RECORDING HEAD, ETC.)
28  DF  FORMING OR TREATING AN ORNAMENTED ARTICLE {4}
33  DF  ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.) {2}
37  DF  ETCHING AND COATING OCCUR IN THE SAME PROCESSING CHAMBER
38  DF  PLANARIZING A NONPLANAR SURFACE
39  DF  FORMING GROOVE OR HOLE IN A SUBSTRATE WHICH IS SUBSEQUENTLY FILLED OR COATED
40  DF  FORMING PATTERN USING LIFT OFF TECHNIQUE
41  DF  MASKING OF A SUBSTRATE USING MATERIAL RESISTANT TO AN ETCHANT (I.E., ETCH RESIST) {9}
52  DF  MECHANICALLY SHAPING, DEFORMING, OR ABRADING OF SUBSTRATE {1}
54  DF  PATTERN OR DESIGN APPLIED BY TRANSFER
55  DF  HEATING OR BAKING OF SUBSTRATE PRIOR TO ETCHING TO CHANGE THE CHEMICAL PROPERTIES OF SUBSTRATE TOWARD THE ETCHANT
56  DF  ETCHING TO PRODUCE POROUS OR PERFORATED ARTICLE
57  DF  GAS PHASE AND NONGASEOUS PHASE ETCHING ON THE SAME SUBSTRATE
58  DF  GAS PHASE ETCHING OF SUBSTRATE {6}
83  DF  NONGASEOUS PHASE ETCHING OF SUBSTRATE {9}