| | CLASS NOTES |
2 | DF | ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION |
3 | DF | FORMING OR TREATING JOSEPHSON JUNCTION ARTICLE |
4 | DF | FORMING OR TREATING A SIGN OR MATERIAL USEFUL IN A SIGN {1} |
6 | DF | FORMING OR TREATING MATERIAL USEFUL IN A CAPACITOR |
7 | DF | FORMING OR TREATING FIBROUS ARTICLE OR FIBER REINFORCED COMPOSITE STRUCTURE |
8 | DF | FORMING OR TREATING CYLINDRICAL OR TUBULAR ARTICLE HAVING PATTERN OR DESIGN ON ITS SURFACE {2} |
11 | DF | FORMING OR TREATING AN ARTICLE WHOSE FINAL CONFIGURATION HAS A PROJECTION |
12 | DF | FORMING OR TREATING MASK USED FOR ITS NONETCHING FUNCTION (E.G., SHADOW MASK, X-RAY MASK, ETC.) |
13 | DF | FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.) {6} |
22 | DF | FORMING OR TREATING ARTICLE CONTAINING MAGNETICALLY RESPONSIVE MATERIAL |
23 | DF | FORMING OR TREATING ARTICLE CONTAINING A LIQUID CRYSTAL MATERIAL |
24 | DF | FORMING OR TREATING OPTICAL ARTICLE {2} |
27 | DF | FORMING OR TREATING THERMAL INK JET ARTICLE (E.G., PRINT HEAD, LIQUID JET RECORDING HEAD, ETC.) |
28 | DF | FORMING OR TREATING AN ORNAMENTED ARTICLE {4} |
33 | DF | ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.) {2} |
37 | DF | ETCHING AND COATING OCCUR IN THE SAME PROCESSING CHAMBER |
38 | DF | PLANARIZING A NONPLANAR SURFACE |
39 | DF | FORMING GROOVE OR HOLE IN A SUBSTRATE WHICH IS SUBSEQUENTLY FILLED OR COATED |
40 | DF | FORMING PATTERN USING LIFT OFF TECHNIQUE |
41 | DF | MASKING OF A SUBSTRATE USING MATERIAL RESISTANT TO AN ETCHANT (I.E., ETCH RESIST) {9} |
52 | DF | MECHANICALLY SHAPING, DEFORMING, OR ABRADING OF SUBSTRATE {1} |
54 | DF | PATTERN OR DESIGN APPLIED BY TRANSFER |
55 | DF | HEATING OR BAKING OF SUBSTRATE PRIOR TO ETCHING TO CHANGE THE CHEMICAL PROPERTIES OF SUBSTRATE TOWARD THE ETCHANT |
56 | DF | ETCHING TO PRODUCE POROUS OR PERFORATED ARTICLE |
57 | DF | GAS PHASE AND NONGASEOUS PHASE ETCHING ON THE SAME SUBSTRATE |
58 | DF | GAS PHASE ETCHING OF SUBSTRATE {6} |
83 | DF | NONGASEOUS PHASE ETCHING OF SUBSTRATE {9} |