US PATENT SUBCLASS 216 / 39
FORMING GROOVE OR HOLE IN A SUBSTRATE WHICH IS SUBSEQUENTLY FILLED OR COATED
Current as of:
June, 1999
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216 /
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ETCHING A SUBSTRATE: PROCESSES
39
FORMING GROOVE OR HOLE IN A SUBSTRATE WHICH IS SUBSEQUENTLY FILLED OR COATED
DEFINITION
Classification: 216/39
FORMING GROOVE OR HOLE IN A SUBSTRATE WHICH IS SUBSEQUENTLY
FILLED OR COATED:
(under the class definition) Process directed to the filling or coating of a groove or hole in a substrate after the groove or hole is formed.
