| 216 / | HD | ETCHING A SUBSTRATE: PROCESSES | 
| 13 |  | FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.) {6} | 
| 14 | DF | .~> Forming or treating lead frame or beam lead | 
| 15 | DF | .~> Forming or treating a crossover | 
| 16 | DF | .~> Forming or treating resistive material | 
| 17 | DF | .~> Forming or treating of groove or through hole {2} | 
| 20 | DF | .~> Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.) | 
| 21 | DF | .~> Repairing circuit |