216 / | HD | ETCHING A SUBSTRATE: PROCESSES |
13 | FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.) {6} | |
14 | DF | .~> Forming or treating lead frame or beam lead |
15 | DF | .~> Forming or treating a crossover |
16 | DF | .~> Forming or treating resistive material |
17 | DF | .~> Forming or treating of groove or through hole {2} |
20 | DF | .~> Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.) |
21 | DF | .~> Repairing circuit |