US PATENT SUBCLASS 216 / 17
.~ Forming or treating of groove or through hole

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

13  DF  FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.) {6}
17.~ Forming or treating of groove or through hole {2}
18  DF  .~.~> Filling or coating of groove or through hole with a conductor to form an electrical interconnection
19  DF  .~.~> Filling or coating of groove or through hole in a conductor with an insulator

DEFINITION

Classification: 216/17

Forming or treating of groove or through hole:

(under subclass 13) Process directed to forming or treating (a) a depression of relatively small area which is formed

partially or completely through an electrical conductor or a substrate supporting an electrical circuit, or (b) an elongated relatively narrow trench which is partially or completely through an electrical conductor or substrate.