US PATENT SUBCLASS 216 / 18
.~.~ Filling or coating of groove or through hole with a conductor to form an electrical interconnection

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

13  DF  FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.) {6}
17  DF  .~ Forming or treating of groove or through hole {2}
18.~.~ Filling or coating of groove or through hole with a conductor to form an electrical interconnection

DEFINITION

Classification: 216/18

Filling or coating of groove or through hole with a conductor to form an electrical interconnection:

(under subclass 17) Process directed to filling or coating of groove or through hole with an electrically conductive material so as to provide an electrical interconnection in a circuit.