(under subclass 13) Process directed to the forming or treating of (a) a group of metal leads held together in the proper relationship to permit connection to a semiconductor die (integrated circuit), or (b) an intermediate article of manufacture utilized to produce electrical connecting structure for circuits consisting of a generally flat electrically conductive strap or band section which has been stamped, cut or otherwise deformed, to produce an open encasing structure provided with a plurality of generally rectangular cross-sectional inwardly facing bodies designed to be attached to the circuit in a cantilever fashion.
SEE OR SEARCH CLASS
29, Metal Working,
827, for beam lead frame or beam lead device manufacturing including a metal working step.
