US PATENT SUBCLASS 216 / 14
.~ Forming or treating lead frame or beam lead


Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use



216 /   HD   ETCHING A SUBSTRATE: PROCESSES

13  DF  FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.) {6}
14.~ Forming or treating lead frame or beam lead


DEFINITION

Classification: 216/14

Forming or treating lead frame or beam lead:

(under subclass 13) Process directed to the forming or treating of (a) a group of metal leads held together in the proper relationship to permit connection to a semiconductor die (integrated circuit), or (b) an intermediate article of manufacture utilized to produce electrical connecting structure for circuits consisting of a generally flat electrically conductive strap or band section which has been stamped, cut or otherwise deformed, to produce an open encasing structure provided with a plurality of generally rectangular cross-sectional inwardly facing bodies designed to be attached to the circuit in a cantilever fashion.

SEE OR SEARCH CLASS

29, Metal Working,

827, for beam lead frame or beam lead device manufacturing including a metal working step.