US PATENT SUBCLASS 216 / 20
.~ Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.)

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

13  DF  FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.) {6}
20.~ Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.)

DEFINITION

Classification: 216/20

Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.):

(under subclass 13) Process including a step of adhesively or autogeneously bonding two or more self-sustaining preforms and wherein the final product contains the two or more adhered layers.

(1) Note. A preformed etching mask or resist is not considered as being a preform proper for this subclass if it ultimately to be removed. See subclasses 41+ for etching processes involving a preformed etch mask or resist.