438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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142 | DF | MAKING FIELD EFFECT DEVICE HAVING PAIR OF ACTIVE REGIONS SEPARATED BY GATE STRUCTURE BY FORMATION OR ALTERATION OF SEMICONDUCTIVE ACTIVE REGIONS {6} |
197 | DF | .~ Having insulated gate (e.g., IGFET, MISFET, MOSFET, etc.) {24} |
199 | | .~.~ Complementary insulated gate field effect transistors (i.e., CMOS) {11} |
200 | DF | .~.~.~> And additional electrical device {4} |
211 | DF | .~.~.~> Having gate surrounded by dielectric (i.e., floating gate) |
212 | DF | .~.~.~> Vertical channel |
213 | DF | .~.~.~> Common active region |
214 | DF | .~.~.~> Having underpass or crossunder |
215 | DF | .~.~.~> Having fuse or integral short |
216 | DF | .~.~.~> Gate insulator structure constructed of diverse dielectrics (e.g., MNOS, etc.) or of nonsilicon compound |
217 | DF | .~.~.~> Doping of semiconductor channel region beneath gate insulator (e.g., threshold voltage adjustment, etc.) |
218 | DF | .~.~.~> Including isolation structure {4} |
229 | DF | .~.~.~> Self-aligned {2} |
233 | DF | .~.~.~> And contact formation |