438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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142 | DF | MAKING FIELD EFFECT DEVICE HAVING PAIR OF ACTIVE REGIONS SEPARATED BY GATE STRUCTURE BY FORMATION OR ALTERATION OF SEMICONDUCTIVE ACTIVE REGIONS {6} |
167 | | .~ Having Schottky gate (e.g., MESFET, HEMT, etc.) {13} |
168 | DF | .~.~> Specified crystallographic orientation |
169 | DF | .~.~> Complementary Schottky gate field effect transistors |
170 | DF | .~.~> And bipolar device |
171 | DF | .~.~> And passive electrical device (e.g., resistor, capacitor, etc.) |
172 | DF | .~.~> Having heterojunction (e.g., HEMT, MODFET, etc.) |
173 | DF | .~.~> Vertical channel |
174 | DF | .~.~> Doping of semiconductive channel region beneath gate (e.g., threshold voltage adjustment, etc.) |
175 | DF | .~.~> Buried channel |
176 | DF | .~.~> Plural gate electrodes (e.g., dual gate, etc.) |
177 | DF | .~.~> Closed or loop gate |
178 | DF | .~.~> Elemental semiconductor |
179 | DF | .~.~> Asymmetric |
180 | DF | .~.~> Self-aligned {1} |