257 / | HD | ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES) |
|
213 | DF | FIELD EFFECT DEVICE {6} |
288 | DF | .~ Having insulated electrode (e.g., MOSFET, MOS diode) {17} |
296 | | .~.~ Insulated gate capacitor or insulated gate transistor combined with capacitor (e.g., dynamic memory cell) {10} |
297 | DF | .~.~.~> With means for preventing charge leakage due to minority carrier generation (e.g., alpha generated soft error protection or "dark current" leakage protection) |
298 | DF | .~.~.~> Capacitor for signal storage in combination with non-volatile storage means |
299 | DF | .~.~.~> Structure configured for voltage converter (e.g., charge pump, substrate bias generator) |
300 | DF | .~.~.~> Capacitor coupled to, or forms gate of, insulated gate field effect transistor (e.g., nondestructive readout dynamic memory cell structure) |
301 | DF | .~.~.~> Capacitor in trench {4} |
306 | DF | .~.~.~> Stacked capacitor {2} |
310 | DF | .~.~.~> With high dielectric constant insulator (e.g., Ta2Os) |
311 | DF | .~.~.~> Storage node isolated by dielectric from semiconductor substrate |
312 | DF | .~.~.~> Voltage variable capacitor (i.e., capacitance varies with applied voltage) |
313 | DF | .~.~.~> Inversion layer capacitor |