438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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142 | DF | MAKING FIELD EFFECT DEVICE HAVING PAIR OF ACTIVE REGIONS SEPARATED BY GATE STRUCTURE BY FORMATION OR ALTERATION OF SEMICONDUCTIVE ACTIVE REGIONS {6} |
197 | DF | .~ Having insulated gate (e.g., IGFET, MISFET, MOSFET, etc.) {24} |
238 | DF | .~.~ Including passive device (e.g., resistor, capacitor, etc.) {1} |
239 | | .~.~.~ Capacitor {5} |
240 | DF | .~.~.~.~> Having high dielectric constant insulator (e.g., Ta2O5, etc.) |
241 | DF | .~.~.~.~> And additional field effect transistor (e.g., sense or access transistor, etc.) {1} |
243 | DF | .~.~.~.~> Trench capacitor {3} |
250 | DF | .~.~.~.~> Planar capacitor {1} |
253 | DF | .~.~.~.~> Stacked capacitor {3} |