257 / | HD | ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES) |
|
213 | DF | FIELD EFFECT DEVICE {6} |
288 | DF | .~ Having insulated electrode (e.g., MOSFET, MOS diode) {17} |
327 | | .~.~ Short channel insulated gate field effect transistor {6} |
328 | DF | .~.~.~> Vertical channel or double diffused insulated gate field effect device provided with means to protect against excess voltage (e.g., gate protection diode) |
329 | DF | .~.~.~> Gate controls vertical charge flow portion of channel (e.g., VMOS device) {1} |
335 | DF | .~.~.~> Active channel region has a graded dopant concentration decreasing with distance from source region (e.g., double diffused device, DMOS transistor) {6} |
344 | DF | .~.~.~> With lightly doped portion of drain region adjacent channel (e.g., LDD structure) |
345 | DF | .~.~.~> With means to prevent sub-surface currents, or with non-uniform channel doping |
346 | DF | .~.~.~> Gate electrode overlaps the source or drain by no more than depth of source or drain (e.g., self-aligned gate) |