257 / | HD | ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES) |
|
213 | DF | FIELD EFFECT DEVICE {6} |
288 | DF | .~ Having insulated electrode (e.g., MOSFET, MOS diode) {17} |
327 | DF | .~.~ Short channel insulated gate field effect transistor {6} |
335 | | .~.~.~ Active channel region has a graded dopant concentration decreasing with distance from source region (e.g., double diffused device, DMOS transistor) {6} |
336 | DF | .~.~.~.~> With lightly doped portion of drain region adjacent channel (e.g., LDD structure) |
337 | DF | .~.~.~.~> In integrated circuit structure {1} |
339 | DF | .~.~.~.~> With means to increase breakdown voltage |
340 | DF | .~.~.~.~> With means (other than self-alignment of the gate electrode) to decrease gate capacitance (e.g., shield electrode) |
341 | DF | .~.~.~.~> Plural sections connected in parallel (e.g., power MOSFET) {1} |
343 | DF | .~.~.~.~> All contacts on same surface (e.g., lateral structure) |