US PATENT SUBCLASS 204 / 298.02
.~.~ Coating

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

193  DF  APPARATUS {5}
298.01  DF  .~ Coating, forming or etching by sputtering {2}
298.02.~.~ Coating {13}
298.03  DF  .~.~.~> Measuring, analyzing or testing
298.04  DF  .~.~.~> Ion beam sputter deposition
298.05  DF  .~.~.~> Ion plating
298.06  DF  .~.~.~> Triode, tetrode, auxiliary electrode or biased workpiece
298.07  DF  .~.~.~> Specified gas feed or withdrawal
298.08  DF  .~.~.~> Specified power supply or matching network
298.09  DF  .~.~.~> Specified cooling or heating
298.11  DF  .~.~.~> Specified mask, shield or shutter
298.12  DF  .~.~.~> Specified target particulars {1}
298.14  DF  .~.~.~> Specified anode particulars
298.15  DF  .~.~.~> Specified work holder
298.16  DF  .~.~.~> Magnetically enchanced {1}
298.23  DF  .~.~.~> Moving workpiece or target {6}

DEFINITION

Classification: 204/298.02

Coating:

(under subclass 298.01) Apparatus including means for the deposition of a coating material on a workpiece (i.e., substrate).

(1) Note. The coating material is usually comprised of material ejected from the target.