US PATENT SUBCLASS 204 / 298.04
.~.~.~ Ion beam sputter deposition

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

193  DF  APPARATUS {5}
298.01  DF  .~ Coating, forming or etching by sputtering {2}
298.02  DF  .~.~ Coating {13}
298.04.~.~.~ Ion beam sputter deposition

DEFINITION

Classification: 204/298.04

Ion beam sputter deposition:

(under subclass 298.02) Apparatus wherein a beam of ions generated by a separate ion source remote from the target is employed to sputter material from the target so that a coating of target material is deposited on a workpiece.