US PATENT SUBCLASS 204 / 298.01
.~ Coating, forming or etching by sputtering

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

193  DF  APPARATUS {5}
298.01.~ Coating, forming or etching by sputtering {2}
298.02  DF  .~.~> Coating {13}
298.31  DF  .~.~> Etching {8}

DEFINITION

Classification: 204/298.01

Coating, forming or etching by sputtering:

(under subclass 193) Apparatus specialized for coating, forming, or etching by sputtering within a vacuum environment (i.e., under reduced pressure) involving bombarding a solid or liquid target with atomic particles to cause target material to be ejected therefrom by momentum transfer.