US PATENT SUBCLASS 204 / 298.31
.~.~ Etching

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

193  DF  APPARATUS {5}
298.01  DF  .~ Coating, forming or etching by sputtering {2}
298.31.~.~ Etching {8}
298.32  DF  .~.~.~> Measuring, analyzing or testing
298.33  DF  .~.~.~> Specified gas feed or withdrawal
298.34  DF  .~.~.~> Auxiliary electrode, bias means or specified power supply
298.35  DF  .~.~.~> Multi-chamber, load/unload means or moving workpiece
298.36  DF  .~.~.~> Beam or directed flux etching (e.g., ion beam, etc.)
298.37  DF  .~.~.~> Magnetically enhanced
298.38  DF  .~.~.~> Microwave excitation
298.39  DF  .~.~.~> Plural parallel plates (e.g., desmearing reactor, etc.)

DEFINITION

Classification: 204/298.31

Etching:

(under subclass 298.01) Apparatus including means for the removal of material from a workpiece (i.e., substrate) by subjecting it to bombardment by atomic particles (e.g., ions), whereby the activation energy of material removal is supplied at least in part by momentum transfer.