US PATENT SUBCLASS 204 / 298.36
.~.~.~ Beam or directed flux etching (e.g., ion beam, etc.)

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

193  DF  APPARATUS {5}
298.01  DF  .~ Coating, forming or etching by sputtering {2}
298.31  DF  .~.~ Etching {8}
298.36.~.~.~ Beam or directed flux etching (e.g., ion beam, etc.)

DEFINITION

Classification: 204/298.36

Beam or directed flux etching (e.g., ion beam, etc.):

(under subclass 298.31) Apparatus including means for sputter etching or ion milling a workpiece utilizing a beam of ions or directed flux generated from a separate ion source.