(under subclass 298.02) Apparatus additionally including means for ionizing at least a portion of the evaporated coated material and for applying a potential to the workpiece, whereby the workpiece is simultaneously subjected to electrostatically aided deposition and sputter etching due to ionic bombardment.
(1) Note. In ion plating apparatus the workpiece serves as a target which is sputter etched.
(2) Note. The potential applied to the workpiece is usually negative.
