| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
|
| 914 |  | DOPING {11} |
| 915 | DF | .~> Amphoteric doping |
| 916 | DF | .~> Autodoping control or utilization |
| 917 | DF | .~> Deep level dopants (e.g., gold (Au), chromium (Cr), iron (Fe), nickel (Ni), etc.) |
| 918 | DF | .~> Special or nonstandard dopant |
| 919 | DF | .~> Compensation doping |
| 920 | DF | .~> Controlling diffusion profile by oxidation |
| 921 | DF | .~> Nonselective diffusion |
| 922 | DF | .~> Diffusion along grain boundaries |
| 923 | DF | .~> Diffusion through a layer |
| 924 | DF | .~> To facilitate selective etching |
| 925 | DF | .~> Fluid growth doping control (e.g., delta doping, etc.) |