438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
|
689 | DF | CHEMICAL ETCHING {6} |
745 | | .~ Liquid phase etching {9} |
746 | DF | .~.~> Utilizing electromagnetic or wave energy |
747 | DF | .~.~> With relative movement between substrate and confined pool of etchant |
748 | DF | .~.~> Projection of etchant against a moving substrate or controlling the angle or pattern of projected etchant |
749 | DF | .~.~> Sequential application of etchant {1} |
752 | DF | .~.~> Germanium |
753 | DF | .~.~> Silicon |
754 | DF | .~.~> Electrically conductive material (e.g., metal, conductive oxide, etc.) {1} |
756 | DF | .~.~> Silicon oxide |
757 | DF | .~.~> Silicon nitride |