US PATENT SUBCLASS 438 / 749
.~.~ Sequential application of etchant

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

689  DF  CHEMICAL ETCHING {6}
745  DF  .~ Liquid phase etching {9}
749.~.~ Sequential application of etchant {1}
750  DF  .~.~.~> To same side of substrate {1}

DEFINITION

Classification: 438/749

Sequential application of etchant:

(under subclass 745) Processes wherein plural liquid phase etching steps are carried out on the semiconductor substrate in succession to one another.