| 257 / | HD | ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES) |
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| 107 |  | REGENERATIVE TYPE SWITCHING DEVICE (E.G., SCR, COMFET, THYRISTOR) {19} |
| 108 | DF | .~> Controlled by nonelectrical, nonoptical external signal (e.g., magnetic field, pressure, thermal) |
| 109 | DF | .~> Having only two terminals and no control electrode (gate) (e.g., Shockley diode) {3} |
| 113 | DF | .~> With light activation {4} |
| 119 | DF | .~> Bidirectional rectifier with control electrode (gate) (e.g., Triac) {9} |
| 132 | DF | .~> Five or more layer unidirectional structure |
| 133 | DF | .~> Combined with field effect transistor {3} |
| 146 | DF | .~> Combined with other solid state active device in integrated structure |
| 147 | DF | .~> With extended latchup current level (e.g., gate turn off "GTO" device) {5} |
| 154 | DF | .~> With resistive region connecting separate sections of device |
| 155 | DF | .~> With switching speed enhancement means (e.g., Schottky contact) {1} |
| 157 | DF | .~> With integrated trigger signal amplification means (e.g., amplified gate, "pilot thyristor", etc.) {4} |
| 162 | DF | .~> Lateral structure |
| 163 | DF | .~> Emitter region feature {1} |
| 167 | DF | .~> Having at least four external electrodes |
| 168 | DF | .~> With means to increase breakdown voltage {2} |
| 172 | DF | .~> With means to lower "ON" voltage drop |
| 173 | DF | .~> Device protection (e.g., from overvoltage) {1} |
| 175 | DF | .~> With means to control triggering (e.g., gate electrode configuration, zener diode firing, dV/dt control, transient control by ferrite bead, etc.) {1} |
| 177 | DF | .~> With housing or external electrode {3} |