438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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142 | DF | MAKING FIELD EFFECT DEVICE HAVING PAIR OF ACTIVE REGIONS SEPARATED BY GATE STRUCTURE BY FORMATION OR ALTERATION OF SEMICONDUCTIVE ACTIVE REGIONS {6} |
197 | DF | .~ Having insulated gate (e.g., IGFET, MISFET, MOSFET, etc.) {24} |
257 | | .~.~ Having additional gate electrode surrounded by dielectric (i.e., floating gate) {8} |
258 | DF | .~.~.~> Including additional field effect transistor (e.g., sense or access transistor, etc.) |
259 | DF | .~.~.~> Including forming gate electrode in trench or recess in substrate |
260 | DF | .~.~.~> Textured surface of gate insulator or gate electrode |
261 | DF | .~.~.~> Multiple interelectrode dielectrics or nonsilicon compound gate insulator |
262 | DF | .~.~.~> Including elongated source or drain region disposed under thick oxide regions (e.g., buried or diffused bitline, etc.) {1} |
264 | DF | .~.~.~> Tunneling insulator |
265 | DF | .~.~.~> Oxidizing sidewall of gate electrode |
266 | DF | .~.~.~> Having additional, nonmemory control electrode or channel portion (e.g., for accessing field effect transistor structure, etc.) {1} |