US PATENT SUBCLASS 216 / 100
.~.~ Substrate contains elemental metal, alloy thereof, or metal compound

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

83  DF  NONGASEOUS PHASE ETCHING OF SUBSTRATE {9}
96  DF  .~ Etching inorganic substrate {3}
100.~.~ Substrate contains elemental metal, alloy thereof, or metal compound {4}
101  DF  .~.~.~> Etching of a compound containing at least one oxygen atom and at least one metal atom
102  DF  .~.~.~> Metal is elemental aluminum, an alloy, or compound thereof {1}
105  DF  .~.~.~> Metal is elemental copper, an alloy, or compound thereof {1}
108  DF  .~.~.~> Etchant contains acid {1}

DEFINITION

Classification: 216/100

Substrate contains elemental metal, alloy thereof, or metal compound:

(under subclass 96) Process wherein the substrate contains metal in elemental, alloy, or compound form.