US PATENT SUBCLASS 216 / 108
.~.~.~ Etchant contains acid

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

83  DF  NONGASEOUS PHASE ETCHING OF SUBSTRATE {9}
96  DF  .~ Etching inorganic substrate {3}
100  DF  .~.~ Substrate contains elemental metal, alloy thereof, or metal compound {4}
108.~.~.~ Etchant contains acid {1}
109  DF  .~.~.~.~> Etchant contains fluoride ion

DEFINITION

Classification: 216/108

Etchant contains acid:

(under subclass 100) Process wherein the substrate is etched with H+ ion producing or containing material.

(1) Note. See Glossary for a definition of the term Acid.