438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
FOR 149 | DF | INCLUDING FORMING A SEMICONDUCTOR JUNCTION (437/15) {7} |
FOR 221 | DF | .~ Including isolation step (437/61) {4} |
FOR 224 | DF | .~.~ Using vertical dielectric (air-gap/insulator) and horizontal PN junction (437/64) {3} |
FOR 229 | DF | .~.~.~ Recessed oxide by localized oxidation (437/69) {3} |
FOR 232 | DF | .~.~.~.~ Preliminary etching of groove (437/72) {1} |
FOR 233 | .~.~.~.~.~ Using overhanging oxidation mask and pretreatment of recessed walls (437/ 73) |