| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
| FOR 149 | DF | INCLUDING FORMING A SEMICONDUCTOR JUNCTION (437/15) {7} |
| FOR 221 | ![]() | .~ Including isolation step (437/61) {4} |
| FOR 222 | DF | .~.~> By forming total dielectric isolation (437/62) |
| FOR 223 | DF | .~.~> By forming vertical isolation combining dielectric and PN junction (437/63) |
| FOR 224 | DF | .~.~> Using vertical dielectric (air-gap/insulator) and horizontal PN junction (437/64) {3} |
| FOR 234 | DF | .~.~> Isolation by PN junction only (437/74) {4} |