US PATENT SUBCLASS 438 / 758
COATING OF SUBSTRATE CONTAINING SEMICONDUCTOR REGION OR OF SEMICONDUCTOR SUBSTRATE

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

758COATING OF SUBSTRATE CONTAINING SEMICONDUCTOR REGION OR OF SEMICONDUCTOR SUBSTRATE {6}
759  DF  .~> Combined with the removal of material by nonchemical means
760  DF  .~> Utilizing reflow (e.g., planarization, etc.)
761  DF  .~> Multiple layers {2}
764  DF  .~> Formation of semi-insulative polycrystalline silicon
765  DF  .~> By reaction with substrate {4}
778  DF  .~> Insulative material deposited upon semiconductive substrate {8}

DEFINITION

Classification: 438/758

COATING OF SUBSTRATE CONTAINING SEMICONDUCTOR REGION OR OF SEMICONDUCTOR SUBSTRATE:

(under the class definition) Processes for forming or applying a coating on a semiconductor substrate, and wherein the intent is to use the electrical properties of the semiconductor for at least one of the purposes outlined in section I, B, of the Class 438 definition above.

(1) Note. Coating limited to nonsemiconductive areas of the substrate is acceptable in this and undented subclasses if the substrate also contains, integral therewith, a semiconductive region functioning as per the Class Definition B, above.

(2) Note. The passivation of dangling bonds on the semiconductor substrate surface (such as by covalently

bonding hydrogen to the surface) is considered to be proper under gettering above.

SEE OR SEARCH THIS CLASS, SUBCLASS:

33, or 465, for formation of a coating combined with substrate dicing.

476, for coating combined with gettering.

478+, for formation of a semiconductive coating. 493, for formation of a nonconductive coating combined with formation of a semiconductive coating.

689, for coating of metal, metallization, or formation of a heat sink.

SEE OR SEARCH CLASS

204, Chemistry: Electrical and Wave Energy,

192.12+, for glow discharge sputter deposition processes.

205, Electrolysis: Processes, Compositions Used Therein, and Methods of Preparing the Compositions, especially

123+, for forming an electrolytic coating on a selected area of a semiconductor substrate and subclass 157 for electrolytic coating a semiconductor substrate.

427, Coating Processes, for processes of coating where the product of the process is generically disclosed for both semiconductive electrical purpose and nonsemiconductive electrical purpose.