US PATENT SUBCLASS 438 / 760
.~ Utilizing reflow (e.g., planarization, etc.)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

758  DF  COATING OF SUBSTRATE CONTAINING SEMICONDUCTOR REGION OR OF SEMICONDUCTOR SUBSTRATE {6}
760.~ Utilizing reflow (e.g., planarization, etc.)

DEFINITION

Classification: 438/760

Utilizing reflow (e.g., planarization, etc.):

(under subclass 758) Processes wherein the coating step is combined with a step of decreasing the viscosity of the layer and causing a redistribution of the same by the viscous flow thereof.