| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
| 584 | DF | COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2} |
| 597 | DF | .~ To form ohmic contact to semiconductive material {24} |
| 618 | DF | .~.~ Contacting multiple semiconductive regions (i.e., interconnects) {5} |
| 622 | DF | .~.~.~ Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) {8} |
| 625 | DF | .~.~.~.~ At least one metallization level formed of diverse conductive layers {4} |
| 629 | DF | .~.~.~.~.~ Diverse conductive layers limited to viahole/plug {1} |
| 630 | | .~.~.~.~.~.~ Silicide formation |