US PATENT SUBCLASS 438 / 615
.~.~.~.~ Including fusion of conductor

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
612  DF  .~.~ Forming solder contact or bonding pad {1}
613  DF  .~.~.~ Bump electrode {2}
615.~.~.~.~ Including fusion of conductor {2}
616  DF  .~.~.~.~.~> By transcription from auxiliary substrate
617  DF  .~.~.~.~.~> By wire bonding

DEFINITION

Classification: 438/615

Including fusion of conductor:

(under subclass 613) Processes wherein at least a portion of the conductive material forming the bump electrode is molten during formation of the bump.