| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
| 584 | DF | COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2} |
| 597 | DF | .~ To form ohmic contact to semiconductive material {24} |
| 612 | DF | .~.~ Forming solder contact or bonding pad {1} |
| 613 | | .~.~.~ Bump electrode {2} |
| 614 | DF | .~.~.~.~> Plural conductive layers |
| 615 | DF | .~.~.~.~> Including fusion of conductor {2} |