US PATENT SUBCLASS 438 / 612
.~.~ Forming solder contact or bonding pad

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
612.~.~ Forming solder contact or bonding pad {1}
613  DF  .~.~.~> Bump electrode {2}

DEFINITION

Classification: 438/612

Forming solder contact or bonding pad:

(under subclass 597) Processes for making an ohmic electrical contact to a semiconductor region which contact also serves as a solder contact or bonding pad.