438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
584 | DF | COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2} |
597 | DF | .~ To form ohmic contact to semiconductive material {24} |
612 | DF | .~.~ Forming solder contact or bonding pad {1} |
613 | DF | .~.~.~ Bump electrode {2} |
614 | .~.~.~.~ Plural conductive layers |