US PATENT SUBCLASS 438 / 616
.~.~.~.~.~ By transcription from auxiliary substrate

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
612  DF  .~.~ Forming solder contact or bonding pad {1}
613  DF  .~.~.~ Bump electrode {2}
615  DF  .~.~.~.~ Including fusion of conductor {2}
616.~.~.~.~.~ By transcription from auxiliary substrate

DEFINITION

Classification: 438/616

By transcription from auxiliary substrate:

(under subclass 615) Processes wherein the bump electrode is formed by transcription of conductive material from an auxiliary substrate to the semiconductor substrate.