US PATENT SUBCLASS 438 / 617
.~.~.~.~.~ By wire bonding

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
612  DF  .~.~ Forming solder contact or bonding pad {1}
613  DF  .~.~.~ Bump electrode {2}
615  DF  .~.~.~.~ Including fusion of conductor {2}
617.~.~.~.~.~ By wire bonding

DEFINITION

Classification: 438/617

By wire bonding:

(under subclass 615) Processes wherein the bump electrode is formed by a process which includes a step of utilizing a metallic wire to form the elevated structure.

(1) Note. If a significant portion of the bonding wire remains attached to the semiconductor substrate and is discernable in the final structure, then original classification is proper in that class providing for the welding of same to a substrate.

SEE OR SEARCH CLASS

219, Electric Heating, appropriate subclasses for a process of joining a bonding wire to a substrate via the application of electric heat.

228, Metal Fusion Bonding, especially

180.1+, for simultaneous bonding of multiple joints and subclass 180.5 for wire bonding.