| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
|
| 22 |  | MAKING DEVICE OR CIRCUIT EMISSIVE OF NONELECTRICAL SIGNAL {12} |
| 23 | DF | .~> Having diverse electrical device {1} |
| 26 | DF | .~> Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor {2} |
| 29 | DF | .~> Including integrally formed optical element (e.g., reflective layer, luminescent material, contoured surface, etc.) {3} |
| 33 | DF | .~> Substrate dicing |
| 34 | DF | .~> Making emissive array {1} |
| 36 | DF | .~> Ordered or disordered |
| 37 | DF | .~> Graded composition |
| 38 | DF | .~> Passivating of surface |
| 39 | DF | .~> Mesa formation {2} |
| 42 | DF | .~> Groove formation {2} |
| 45 | DF | .~> Dopant introduction into semiconductor region |
| 46 | DF | .~> Compound semiconductor {1} |