438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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22 | | MAKING DEVICE OR CIRCUIT EMISSIVE OF NONELECTRICAL SIGNAL {12} |
23 | DF | .~> Having diverse electrical device {1} |
26 | DF | .~> Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor {2} |
29 | DF | .~> Including integrally formed optical element (e.g., reflective layer, luminescent material, contoured surface, etc.) {3} |
33 | DF | .~> Substrate dicing |
34 | DF | .~> Making emissive array {1} |
36 | DF | .~> Ordered or disordered |
37 | DF | .~> Graded composition |
38 | DF | .~> Passivating of surface |
39 | DF | .~> Mesa formation {2} |
42 | DF | .~> Groove formation {2} |
45 | DF | .~> Dopant introduction into semiconductor region |
46 | DF | .~> Compound semiconductor {1} |