US PATENT SUBCLASS 438 / 26
.~ Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

22  DF  MAKING DEVICE OR CIRCUIT EMISSIVE OF NONELECTRICAL SIGNAL {12}
26.~ Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor {2}
27  DF  .~.~> Having additional optical element (e.g., optical fiber, etc.)
28  DF  .~.~> Plural emissive devices

DEFINITION

Classification: 438/26

Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor:

(under subclass 22) Process including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).

SEE OR SEARCH THIS CLASS, SUBCLASS:

64, for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a packaged semiconductor device responsive to electromagnetic radiation.

106, for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a packaged semiconductor device.