US PATENT SUBCLASS 438 / 33
.~ Substrate dicing

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

22  DF  MAKING DEVICE OR CIRCUIT EMISSIVE OF NONELECTRICAL SIGNAL {12}
33.~ Substrate dicing

DEFINITION

Classification: 438/33

Substrate dicing:

(under subclass 22) Process having a step of dividing the semiconductor substrate into plural separate bodies.

(1) Note. The dicing may be done by any manner, such as abrading, sawing, etching, cleavage, or a combination thereof.

SEE OR SEARCH CLASS

83, Cutting, for generic processes of cutting a substrate

into discrete individual units.

225, Severing by Tearing or Breaking,

1+, for methods.

451, Abrading, for a process of dicing by abrading.