US PATENT SUBCLASS 216 / 69
.~.~.~ Using microwave to generate the plasma

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

58  DF  GAS PHASE ETCHING OF SUBSTRATE {6}
63  DF  .~ Application of energy to the gaseous etchant or to the substrate being etched {4}
67  DF  .~.~ Using plasma {3}
69.~.~.~ Using microwave to generate the plasma {1}
70  DF  .~.~.~.~> Magnetically enhancing the plasma

DEFINITION

Classification: 216/69

Using microwave to generate the plasma:

(under subclass 67) Process wherein the plasma is produced by the use of microwaves.