438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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FOR 149 | DF | INCLUDING FORMING A SEMICONDUCTOR JUNCTION (437/15) {7} |
FOR 150 | DF | .~ Using energy beam to introduce dopant or modify dopant distribution (437/ 16) {5} |
FOR 155 | DF | .~.~ Of semiconductor on insulating substrate (437/21) {14} |
FOR 161 | DF | .~.~.~ Including multiple implantations of same region (437/27) {4} |
FOR 165 |  | .~.~.~.~ Forming bipolar transistor (NPN/PNP) (437/31) {2} |
FOR 166 | DF | .~.~.~.~.~> Lateral bipolar transistor (437/32) |
FOR 167 | DF | .~.~.~.~.~> Having dielectric isolation (437/33) |