US PATENT SUBCLASS 438 / 713
.~.~.~.~ Forming tapered profile (e.g., tapered etching, etc.)

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

689  DF  CHEMICAL ETCHING {6}
706  DF  .~ Vapor phase etching (i.e., dry etching) {3}
707  DF  .~.~ Utilizing electromagnetic or wave energy {3}
710  DF  .~.~.~ By creating electric field (e.g., plasma, glow discharge, etc.) {17}
713.~.~.~.~ Forming tapered profile (e.g., tapered etching, etc.)

DEFINITION

Classification: 438/713

Forming tapered profile (e.g., tapered etching, etc.):

(under subclass 710) Processes wherein the etchant removes material from the substrate resulting in a mesa or trench profile possessing nonparallel sides.