US PATENT SUBCLASS 438 / 700
.~.~ Formation of groove or trench
Current as of:
June, 1999
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438 /
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SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS
689
DF
CHEMICAL ETCHING
{6}
694
DF
.~ Combined with coating step {5}
700
.~.~ Formation of groove or trench {2}
701
DF
.~.~.~
> Tapered configuration
702
DF
.~.~.~
> Plural coating steps
DEFINITION
Classification: 438/700
Formation of groove or trench:
(under subclass 694) Processes wherein at least one groove or trench is formed by a combination of chemical etching and material deposition.