US PATENT SUBCLASS 438 / 700
.~.~ Formation of groove or trench


Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

689  DF  CHEMICAL ETCHING {6}
694  DF  .~ Combined with coating step {5}
700.~.~ Formation of groove or trench {2}
701  DF  .~.~.~> Tapered configuration
702  DF  .~.~.~> Plural coating steps


DEFINITION

Classification: 438/700

Formation of groove or trench:

(under subclass 694) Processes wherein at least one groove or trench is formed by a combination of chemical etching and material deposition.