US PATENT SUBCLASS 438 / 701
.~.~.~ Tapered configuration

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

689  DF  CHEMICAL ETCHING {6}
694  DF  .~ Combined with coating step {5}
700  DF  .~.~ Formation of groove or trench {2}
701.~.~.~ Tapered configuration

DEFINITION

Classification: 438/701

Tapered configuration:

(under subclass 700) Processes wherein the viahole or trench is formed so as to possess nonparallel sides.