US PATENT SUBCLASS 438 / 697
.~.~ Planarization by etching and coating

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

689  DF  CHEMICAL ETCHING {6}
694  DF  .~ Combined with coating step {5}
697.~.~ Planarization by etching and coating {2}
698  DF  .~.~.~> Utilizing reflow
699  DF  .~.~.~> Plural coating steps

DEFINITION

Classification: 438/697

Planarization by etching and coating:

(under subclass 694) Processes wherein at least one surface of the semiconductor substrate is leveled through a combination of chemical etching and material deposition.

(1) Note. The material being planarized may or may not be that layer which was deposited.