US PATENT SUBCLASS 438 / 698
.~.~.~ Utilizing reflow

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

689  DF  CHEMICAL ETCHING {6}
694  DF  .~ Combined with coating step {5}
697  DF  .~.~ Planarization by etching and coating {2}
698.~.~.~ Utilizing reflow

DEFINITION

Classification: 438/698

Utilizing reflow:

(under subclass 697) Processes wherein the planarization

method requires decreasing the viscosity of a layer residing on the substrate in order to fluidize the same.