US PATENT SUBCLASS 438 / 693
.~.~.~.~ Utilizing particulate abradant

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

689  DF  CHEMICAL ETCHING {6}
690  DF  .~ Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) {1}
691  DF  .~.~ Combined mechanical and chemical material removal {1}
692  DF  .~.~.~ Simultaneous (e.g., chemical-mechanical polishing, etc.) {1}
693.~.~.~.~ Utilizing particulate abradant

DEFINITION

Classification: 438/693

Utilizing particulate abradant:

(under subclass 692) Processes wherein the mechanical material removal is affected through the use of a particulate abrasive material.